Core technology supporting OSRDA: FSNIP
Can be manufactured with small devices and in small area factories! Achieving an excellent method that does not cause alignment shifts.
We would like to introduce our technology, 'FSNIP (Free Substrate material Narrow pitch Imprinted Process).' By transferring conductive paste onto a substrate using the imprinting method, we can simultaneously form wiring and bumps with a pitch of 40μm or less, with a minimum pitch of 10μm. Due to the transfer wiring method, it can be manufactured with low-cost equipment and in small area factories, and because wiring and bumps are formed simultaneously, it achieves an excellent method that does not result in alignment shifts. 【Features】 ■ Transfer of conductive paste onto the substrate using the imprinting method ■ Simultaneous formation of wiring and bumps with a pitch of 40μm or less, with a minimum pitch of 10μm ■ Can be manufactured with low-cost equipment and in small area factories ■ No alignment shifts occur *For more details, please refer to the PDF document or feel free to contact us.
- Company：コネクテックジャパン
- Price：Other
